Integration of Semiconductor Systems
The ultimate goal of semiconductor systems is to create an integrated system that performs multiple functions, such as input, processing, and storage of information, rather than just a single operation. This holistic approach aims to enhance the efficiency and capability of semiconductor technologies. Our research lab is dedicated to improving each functional element of these systems and integrating various subsystems responsible for different operations into a single, cohesive system.
To achieve this, we focus on several key areas. First, we work on optimizing individual components, ensuring that each part operates at its highest potential. This involves extensive research and development to enhance the performance, reliability, and efficiency of these elements. By addressing the specific needs of each component, we can create a robust foundation for integrated systems.
Building on the advancements in Monolithic 3D-IC (Three-Dimensional Integrated Circuit) technology, we conduct studies to simultaneously configure two or more systems through semiconductor processes. This approach allows us to stack and integrate multiple layers of circuits, significantly increasing the density and functionality of the semiconductor devices. Our research in this area aims to streamline the manufacturing process, reduce costs, and improve the overall performance of the integrated systems. One of our notable projects involves the integration of graphene and silicon semiconductors. By combining these materials into a single circuit, we have successfully verified its operation, demonstrating the potential for high-performance, multifunctional semiconductor devices. Graphene, with its exceptional electrical properties, complements the well-established silicon technology, resulting in circuits that can operate more efficiently and at higher speeds.
Additionally, we are conducting research on implementing fusion semiconductor systems based on the operation of image sensor devices using GaO (Gallium Oxide). GaO offers unique advantages in terms of sensitivity and performance, making it an ideal candidate for advanced image sensor applications. Our work in this area involves developing new fabrication techniques, optimizing the material properties, and integrating these sensors into broader semiconductor systems.
Moreover, we are exploring the integration of various other materials and technologies to create more versatile and capable semiconductor systems. This includes investigating new materials that could potentially replace or complement existing semiconductor technologies, as well as developing novel architectures that can better support the integration of multiple functions.
Our comprehensive approach ensures that we are not only advancing individual components but also creating innovative solutions for integrating these components into seamless systems. By focusing on both the micro (component level) and macro (system level) aspects of semiconductor technology, we aim to push the boundaries of what is possible in this field.
