Research on Advanced Packaging and Interconnect Structures

Semiconductor packaging technology is increasingly recognized for its critical role in the integration of semiconductor systems. It goes beyond simply packing a completed chip; it involves integrating various semiconductor systems into a single, cohesive unit. This integration requires highly precise microscopic processes, moving away from traditional macroscopic methods. Our research lab is dedicated to advancing semiconductor packaging by focusing on improving power efficiency and thermal management, which are crucial aspects of modern semiconductor technology.

The importance of packaging technology lies in its ability to achieve high integration density. As the integration density increases, the challenge of managing heat generation and potential thermal degradation becomes more pronounced. Effective thermal management is essential to maintain the performance and reliability of semiconductor devices. High temperatures can lead to faster degradation of materials and reduced lifespan of the components. Therefore, our research aims to develop advanced packaging solutions that mitigate these thermal issues.

Power efficiency is another critical concern in semiconductor packaging. Efficient power management ensures that input signals are transmitted effectively to the operational stages of the system. This involves minimizing power loss and enhancing the overall energy efficiency of the device. To address these challenges, our lab conducts extensive research on identifying the factors that cause power efficiency degradation, particularly at the interconnect and bonding interfaces within semiconductor systems. Our research involves several key areas. First, we perform detailed modeling and simulation to understand the behavior of power and thermal dynamics in semiconductor packages. These models help us identify potential bottlenecks and areas for improvement. Based on our findings, we develop and validate new process technologies aimed at enhancing power efficiency and thermal performance. This includes optimizing the design of interconnect structures and bonding techniques to reduce power loss and improve heat dissipation. Additionally, we explore the use of advanced materials with superior bonding and thermal transfer properties. These materials are critical in improving the overall thermal performance and stability of semiconductor systems. By selecting and integrating materials that offer better thermal conductivity and lower thermal resistance, we can enhance the heat dissipation capabilities of the package, thereby maintaining optimal operating temperatures and ensuring the longevity and reliability of the semiconductor devices.

Moreover, our research extends to developing innovative packaging architectures that support high integration density while effectively managing power and thermal issues. This includes multi-layered and three-dimensional packaging solutions that provide better electrical and thermal performance compared to traditional two-dimensional packages. These advanced architectures are designed to meet the demands of modern high-performance semiconductor applications, such as in computing, telecommunications, and consumer electronics.